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Location: Products >> Thin Film >> Process Control >> Optical Emission >> PlasmaScope
PlasmaScope - Multichannel Optical Emission Spectrometer Compact Platform
PlasmascopeThe Plasmascope is an advanced plasma monitor and end point detection system specially designed for process development and small production units. It uses high resolution spectrograph for simultaneous measurement from 190 to 850 nm allowing handling multi-channel recording in real-time. Its compact package incorporates an optical fibre input and provides both easy measurement and easy installation advantages to tailor the system capabilities to your experiment's demands. The instrument provides very high performance in terms of accuracy and reliability, making it the ideal in-situ monitoring solution for today's shrinking geometries and complex multi-step processes.

The integrated PlasmaScope software package has been designed to process data simply and reliably via predefined recipes while delivering broad functionality for advanced analysis and reprocessing capabilities.

Key Features

  • Advanced algorithms for data acquisition and signal treatment.
  • Multiple endpoint conditions, multiwavelengths.
  • Easy recipe concept to define the measurement conditions as well as the analytical methodology of signal processing.
  • Predefined recipe for turnkey process operation.
  • Integrated SQL database for data management and safe data storage
  • High reprocessing capabilities for review and end point optimization allowing a minimum number of wafers for engineering.
  • Advanced process statistics for long-term monitoring of process and health chamber behavior.
  • Full connectivity to cluster tool & factory host via integrated pass-through and process engineer desk.
  • Open platform for easy integration of multi sensors.

The Plasmascope provides the versatility and performance required for a wide range of applications that can be grouped into four main categories:

  • Engineering tasks such as process optimization, trouble shooting to greatly improve throughput, increase productivity, and reduce costs.
  • Endpoint control with unprecedented specificity and precision.
  • Fault detection by real-time in-situ plasma composition monitoring.
  • Advanced Process Control.

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